TGV

TGV：研究玻璃通孔（TGV）制造新方法，旨在实现高深宽比、无应力裂纹的玻璃微通孔快速、低成本金属化填充。

主要挑战：在玻璃微通孔中实现高密度、低电阻且收缩率低的金属填充，同时避免传统电镀工艺的复杂性、高成本及环境问题。

最近的文章：

2025

Hu Z, Wang H, Li S, et al. Wafer-level fabrication of FAIMS chips based on TGV technology[J]. Journal of Microelectromechanical Systems, 2025. https://ieeexplore.ieee.org/abstract/document/10964379

Wei J, Shen C, Li S, et al. An Improved YOLOv8 Algorithm for TGV Microvia Defect Detection[C]//2025 6th International Conference on Artificial Intelligence and Electromechanical Automation (AIEA). IEEE, 2025: 205-210. https://ieeexplore.ieee.org/abstract/document/11160598

2024

C. Xu et al., "A New Method of TGVs for Fast Filling of Metal Paste," 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Tianjin, China, 2024, pp. 1-5, doi: 10.1109/ICEPT63120.2024.10668787. https://ieeexplore.ieee.org/document/10668787